LCD wafer cutting wire 0.30mm

Product Description

Diamond cutting wire is a new products by our own research and development.The quality of product has reached the world leading level. Products are used in cutting supplies supporting the manual, in-line, multi-wire cutting machines, it can replace the cutting process of light abrasive. For precise cutting various types of artificial crystal, ceramic, quartz glass, monocrystalline silicon, polycrystalline silicon, sapphire and special metal materials and so on. LCD wafer cutting wire

Technical parameters:

1, Diameter: 0.12 ~ 0.36mm, diameter deviation ≤ 0.01mm

2, Bus Material: high strength steel wire cutting

3, Grit size of diamond: 5μm ~ 60μm, we can design according to the customer's requirements

4, The tensile strength: 3200 ~ 3400Mpa

5, Wire length: we can processing according to user's requirements